| PART |
Description |
Maker |
| M570 |
Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMIC’s
|
M/A-COM Technology Solutions, Inc.
|
| KS57P2316 |
BONDING DIAGRAM
|
Samsung semiconductor
|
| WBSC0504-22NF-50V |
Wire Bonding Silicon Vertical Capacitor
|
Micross Components
|
| TAB-35006 |
Tape Carrier Package/Tape Automated Bonding (TCP/TAB)
|
Yamaichi Electronics
|
| XB15A308 |
High Power Handling
|
TOREX[Torex Semiconductor]
|
| AB108 |
Assembly and Handling Information
|
Lumileds Lighting Compa...
|
| TMP93CF77F TMP95CS54F TMP96C141BF TMP91C016F TMP91 |
Quality And Reliability Assurance / Handling Precautions
|
TOSHIBA[Toshiba Semiconductor]
|
| AN260 |
HANDLING AND MOUNTING ICS IN PLASTIC POWER PACKAGES
|
SGS Thomson Microelectronics
|
| PC1602LRS-LWA-H-YM PC1602LRS-LWA-B |
PRECAUTION RELATING PRODUCT HANDLING
PC1602LRS-LWA-H-YM
|
Powertip Technology Corp.
|
| NJL5809K |
Digital Output Photo Reflector(?ㄤ?浼???ㄧ??板?杈?????灏??)
Precaution for Handling
|
New Japan Radio Co., Ltd.
|
| AO4610 |
P & N-Channel 30-V (D-S) MOSFET High power and current handling capability
|
ShenZhen FreesCale Electronics. Co., Ltd
|
